Automated PCB Assembly-line AOI (IPC610D)- Cut errors & rework... before problems even start
Samples were 100% X-RAY-ray inspection to ensure the reliability of each ball BGA
KIC furnace temperature tester: furnace temperature control at ± 0.1 °C to ensure the quality of each board welding
SMT Automatic first piece tester to ensure that each RC component of the parameters within the standard range
High-definition CCD microscopy does not miss the subtle quality and safety hazards
Product function analysis equipment to ensure that the test function of the rapid failure of maintenance